Project Description
Nanometer insulation board
Nanometer insulation board
The nanometer board is a kind of effective thermal insulation material manufactured based on the principle of nanometer micro-pore. It is manufact ured by pressing ma]or components of nanometer silica and black material micro powder with very high heat reflection, having a heat conductivity coefficient which is still smaller than that of static atmosphere. It is more than 3 times the heat insulation performance of traditional insulation materials. Green environment protection and efficient energysaving. Various specifications and models can be customized as required by users. Main application: Strengthened insulation layers for various thermal furnaces.
Technical indicators of the nanometer insulation board
| Indicator name | Nanometer insulation board |
| Volume density(g/cm³） | 0.25~0.30 |
| Thermal conductance/w.(m.k)−¹ | |
| 200℃ | 0.024 |
| 400℃ | 0.027 |
| 600℃ | 0.035 |
| 800℃ | 0.039 |
| Specific heat capacity/Kj.(kg.k)−¹ | 1.05 |
| Compression strength/M P a | Compress10%>3kgf/cm² |
| Classification temperature(℃) | 1000 |
| Shrinking percentage at high temperature(900℃*12h) | <2% |
High-temperature binder
Aust series high-temperature binders are manufactured through mixing and blending nanometer silica colloid and high-purity kaolin based on a certain ratio with features of high fire resistance (the maximum temperature for safe and long-term use can reach 1600℃); and high bonding strength (the com-pressive strength can exceed 2MPa after binders are dry); They are mainly used for bonding and bricklaying of refractory materials in various high-temperature furnaces.
This product can be used immediately provided the package is opened, without adding anything. The bonding strength of any temperature interval from normal temperature to the maximum use temperature is more than 2MPa. This product overcomes the shortcoming that most binders do not have bonding strength between 650℃ and 1000℃. It can also realize bonding among different materials with good bonding effec.
High temperature adhesive technology index
| Performance indicators | Aust-1400 model | Aust-1600 model | |
| Refractoriness/℃ | 1470 | 1680 | |
| Rupture strength/MPa | 110℃*24h | >2 | >2 |
| >650℃*3h | >2 | >2 | |
| Grain size composition/% | ±0.5mm | <1 | <1 |
| -0.12mm | >90 | >90 | |
| Chemical components/% | Al2O3 | 22~24 | |
| Na2O | 3.4~4.8 | 3.2~4 | |
| SiO3 | 52~56 | ||
| Free carbon℃ | 7~9 | ||
